IC Packaging - Moldex3D Europe

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IC Packaging

With Moldex3D IC Packaging You Can

Understand and solve manufacturing issues during and after encapsulation process.
Verify a broad range of different encapsulation processes beyond transfer molding.
Make your encapsulation process economical by saving mold trials and the usage of expensive molding compound.

Highlight

Reliable solution for plastic chip
encapsulation process:
Capable of capturing different molding
phenomena such as void, air trap
and short shot.

Ideal package to reveal process-induced
chip quality issues:
A powerful tool to validate quality issues of
IC components like wire sweep
and paddle shift.

Top instruments to analyze post-mold processes:
Possibility to extend simulation to post-mold curing.

IC Packaging Brochure

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