What's New in Moldex3D 2021 ?
The brand new Moldex3D 2021
A key platform that connects you to the Industry 4.0 era
With better prediction accuracy, deeper insights,
smart integration, and faster calculation,
Moldex3D helps you race against time,
and be the front-runner in smart manufacturing!
Smart Integration
Integrating various data is always a hassle. Moldex3D provides intelligent integrations that can read different graphics files and simplify the converting process. You can seamlessly integrate on-site mold trials with the design analysis database to ensure a smoother corporate workflow, realizing smart design and manufacturing!
Advanced Process
Simulation Upgrades
Advanced process simulation capabilities, including compression molding and foaming process, are upgraded to the next level. Moldex3D also supports RTM process flow, curing analysis and thermoplastic continuous fiber composite molding. The more complicated the process, the more we can help!
The World’s Best IC Packaging Process Simulation
The semiconductors market is evolving at an unprecedented speed. The industry is looking for more cutting-edge CAE technology to level up their production efficiency. With a user-friendly operating platform, high-quality mesh and advanced features, Moldex3D IC Packaging is undoubtedly the answer to packaging revolution.
What’s New in Moldex3D 2021
Prediction Accuracy
Powerful smart Integration
Advanced Process and Composite Materials Forecast
IC Packaging Process Simulation Optimization
Contact Us to Experience Moldex3D 2021 and Download What’s New
Fill out the form to download the What’s New document and have a Moldex3D representative contact you to help you learn more about Moldex3D’s features and functions.