Project Description

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Welcome to Moldex3D Digital Transformation 2021 Online Sessions, an online version of our event series that spans the globe welcoming transformational experts and featured speakers eager to share insights into what could be the most business-critical area of our time and learn more on enterprise digital transformation.

This online conference will dive deeper than ever before into the world of digital business in the manufacturing process, going beyond digital transformation and making real sense of transformation through business use cases, common challenges and inspirational ideas.

The event will run from 09:00 until 15:00 (CEST) on 22nd & 23rd of September with keynote presentations, and live Q&A sessions as well as enhanced virtual networking throughout on our event platform for 2021.

A variety of content

Keynote presentations and live Q&A sessions make the online event dynamic and engaging

Agenda

Featured Speakers

Speakers from enterprise organisations sharing real business use cases

Speakers
Become Speaker

A variety of content

Keynote presentations and live Q&A sessions make the online event dynamic and engaging

Agenda

Featured Speakers

Speakers from enterprise organisations sharing real business use cases

Speakers

Join the Conference

Register now for the free conference & Remote conference platform that allows you to log in from wherever you may be working

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Agenda

Day 1 – September 22

From 9:00 – 14:00 (CEST) | Check your time

  Session Presenter
09:10-09:35 Digital twin technology for rubber seal manufacturing

SKF

Roy Ovink

09:35-09:54 Enhancing prediction accuracy via sensor technologies

RJG, Inc.

Cory Hoeppner

09:54-10:20 Annealing Simulation Case Study in an Automotive Application

Dr. Schneider Automotive Polska Sp. z o.o.

Przemysław Narowski

10:20-10:40 Life of a research lab: bonding strength into simulation

Budapest University of Technology and Economics

Dr. Kovács József Gábor Anna SZUCHÁCS

10:40-11:05 Anisotropic Structural Material Modeling for SMC Materials

Hexagon

Dustin Souza

11:05-11:40 Material Digital Twin and Material Hub Cloud Service

Moldex3D

David Hsu

11:40-12:30 Break

 

12:30-12:55 An application of the new Warpage algorithms in Moldex3D 2021 to shrinkage measurement of polyamide test plaques

RADICI

Claudio Ghilardi

12:55-13:10 E-Mobility – MouldTex, Friction reduction in dynamic Seal trough mould Lasering.

ORP

Mr. Anthony Dossi
Mr. Ugo Finazzi

13:10-13:40 Thermal Mold Simulation – Why is it so important?

SimpaTec

Cristoph Hinse

13:40-14:10 Machine Digital Twin for Smart Manufacturing

Moldex3D

Allen Peng

Day 2 – September 23

From 9:00 – 14:00 (CEST) | Check your time

  Session Presenter
09:05-09:35 Annealing simulation of Mouse coffin

BASF

Jin Jing (Jimmy Jin) Zeng Yue (Helen)

09:35-10:05 Software ecosystems for enabling incresingly realistic simulations of fiber-reinforced components

ANSYS

Fabio Pavia

10:05-10:32 Procedure for the automated design of conformal cooling channels based on temperature maps and the use of discrete models

Universidad de Jaén

Cristina Martín Doñate

10:32-10:40 Break

 

10:40-10:50 Moldex3D-Catia combination to provide the “counter-deformation” model.

m3d srl

Simone Spuri SIlvestrini

10:50-11:05 The Coupled Process Analysis (CPA) in application with Modlex3D

IWU Fraunhofer Institute

Patrick Ackert

11:05-11:15 Break

 

11:15-11:25 The importance of capturing the Physics of the Molding process

BIMS-SEMINARS SRL

Dr. Vito Leo

11:25-11:50 Optimization of cascade moulding process for Pipe protector

CAFUTA d.o.o.

Tjaš Žigante

Tomaž Kastelic

11:50-12:15 Injection Molding Simulations Set-up and Experimental Validation Using an In-mold Flow Visualization System

DTU

Guido Tosello

12:15-12:45 Break  
12:45-13:15 Data-Driven Molding Trial

Mustermind

Jonas Triebel

13:15-13:35 Tips for Collaborative Plastics Mold Development and Managing Molding Knowledge

Moldex3D

Venny

Speaker

Cory Hoeppner
Cory HoeppnerProject Manager
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Zeng Yue
Zeng YueExpert of non-reactive and reactive system processing simulation
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Jimmy Jin
Jimmy JinTeam leader of Processing & Digitalization
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Cristoph Hinse
Cristoph HinseCEO
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Fabio Pavia
Fabio PaviaSenior Product Manager
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József Gábor KOVÁCS
József Gábor KOVÁCSassociate professor
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Anna SZUCHÁCS
Anna SZUCHÁCSPhd Student
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Roy Ovink
Roy OvinkSenior Researcher
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Cristina Martín Doñate
Cristina Martín DoñateProf.Dr. Dpt. of Engineering Graphics, Design and Projects Head of Research Group
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Tjaš Žigante
Tjaš ŽiganteSimulation Engineer
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Tomaž Kastelic
Tomaž KastelicDevelopment and Simulation Engineer
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Anthony Dossi
Anthony DossiExport Manager
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Ugo Finazzi
Ugo FinazziTechnical Dept. Manager
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Claudio Ghilardi
Claudio GhilardiCAE Analyst, MKT & Tech. Service
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Przemysław Narowski
Przemysław NarowskiCAE Engineer
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David Hsu
David HsuDeputy CEO, Moldex3D
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Venny Yang
Venny YangDeputy CEO, Moldex3D
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Allen Peng
Allen PengDeputy CEO, Moldex3D
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Dustin Souza
Dustin SouzaSenior Application Engineer
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Simone Spuri SIlvestrini
Simone Spuri SIlvestriniProgettista
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Jonas Triebel
Jonas TriebelFounder of mustermind.de
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Guido Tosello
Guido ToselloAssociate Professor
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Dr. Vito LEO
Dr. Vito LEO Director
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Patrick Ackert
Patrick AckertResearch Associate
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*You can contact our member Jseeica Lin at jessicalin@moldex3d.com if there are any questions.